POOSHESH STEELPERGAS

UNS C19020 Nickel-Tin Copper

Copper Alloys

HR02 (half-hard and stress relieved)

Property Overview

Density8.9g/cm³
Elastic Modulus120GPa
Tensile Strength440MPa
Yield StrengthUnknown
Brinell HardnessUnknown
Maximum Service Temperature200°C
Weight Calculator

Chemical Composition

NI
0.5 to 3.0%
P
0.010 to 0.2%
CU
95.7 to 99.19%
RES.
Residuals res. | | 0 to 0.2%
RESIDUALS RES.
0 to 0.2%
SN
0.3 to 0.9%

Mechanical

Elastic (Young's, Tensile) Modulus
120 GPa
Elongation at Break
5.7 %
Poisson's Ratio
0.34
Shear Modulus
44 GPa
Shear Strength
260 MPa
Tensile Strength: Ultimate (UTS)
440 MPa

Physical

Density
8.9 g/cm 3

Thermal

Latent Heat of Fusion
210 J/g
Maximum Temperature: Mechanical
200 °C
Melting Completion (Liquidus)
1090 °C
Melting Onset (Solidus)
1030 °C
Specific Heat Capacity
390 J/kg-K
Thermal Conductivity
190 W/m-K
Thermal Diffusivity
55 mm 2 /s
Thermal Expansion
17 µm/m-K
Thermal Shock Resistance
16 points

Electrical

Electrical Conductivity: Equal Volume
50 % IACS
Electrical Conductivity: Equal Weight (Specific)
50 % IACS

Calculated

Stiffness to Weight: Axial
7.2 points
Stiffness to Weight: Bending
18 points
Strength to Weight: Axial
14 points
Strength to Weight: Bending
14 points

Environmental

Base Metal Price
31 % relative
Embodied Carbon
2.8 kg CO 2 /kg material
Embodied Energy
44 MJ/kg
Embodied Energy
44 MJ/kg 19 x 10 3 BTU/lb
Embodied Water
310 L/kg
Embodied Water
310 L/kg 37 gal/lb
Registered Designations & Aliases
C19020UNS C19020 Nickel-Tin Copper
Standards

ASTM B422 ASTM B422: Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper- Nickel-Tin Alloy Sheet and Strip

ASTM B422 ASTM B422: Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper- Nickel-Tin Alloy Sheet and Strip Copper Alloys: Preparation, Properties and Applications, Michael Naboka and Jennifer Giordano (editors), 2013